ROMIS
Modular electronics for inspection systems
Electronics are an important component for the operation of a test system as they enable the generation, reception and processing of sensor signals as well as the control of the individual system elements. This is even more true in demanding inspection environments that require test systems with a reliable, robust, and flexible electronic infrastructure. Our modular inspection system is a user-friendly electronic environment for automated inspection systems that supports different types of inspection technologies. It can be adapted to individual applications and requirements.
ROMIS UT: Modular electronics for ultrasound inspection
ROMIS combines proven components with a robust design in the form of a closed, fanless housing with a small form factor to ensure the best possible data quality. With basic inspection electronics, several front-end modules and a powerful back-end module, the concept supports different inspection technologies. ROMIS UT provides a 16-channel system for conventional ultrasound inspection. The sealed design makes it particularly useful for large multi-channel inspection systems, such as heravy plate or weld inspection systems. The enclosed and compact housing with a passive cooling concept allows front-end configurations to be implemented in close proximity to the transducer, minimizing cable length and avoiding costly front-end cabinets. ROMIS UT is available with separate or connected transmitter/receiver pairs, depending on the requirement.
ROMIS PAUT: Modular electronics for phased array inspection
ROMIS PAUT is the phased array based variant of the ROMIS electronics family. As today’s phased array applications are intended to provide high inspection density combined with high inspection speed, ROMIS PAUT is based on a rigorously implemented parallel approach combined with a paint-brush evaluation unit. The three variants of ROMIS PAUT offer different numbers of channels: the high-end unit is a 256:256 parallel system, the medium and small units offer a 128:128 parallel and a 2x 32:128 channel configuration. The option to drive an external multiplexer allows the future use of matrix arrays with an aperture up to 256 elements. Last but not least, the lean, power-saving design allows closed housings with passive cooling also for the 256 parallel channel version.
ROMIS ET: Modular electronics for eddy current array inspection
ROMIS ET is a modular design for eddy current inspection with a special focus on eddy current array integration. Each ROMIS unit has a compact blade design and can be operated individually or in combination with up to 20 other ROMIS ET units. The modular design allows ROMIS ET to be implemented as a distributed system, each unit directly at the sensor or combined in a standard rack. Each blade provides eight channels. With a multiplexing feature, up to 32 coils can be connected to that channel at a multiplex rate of up to 100kHz, giving a total number of 256 channels. Advanced signal processing features include various filter options, hardware gating and real-time distance compensation. The same modular principal applies to the complementary operating and evaluation software. Starting from the basic functions, the necessary software modules can be easily added and configured to meet the requirements of a specific application.